MiJing 3D BGA Reball Stencil For A9 iPhone 6S/6SP
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  • MiJing 3D BGA Reball Stencil For A9 iPhone 6S/6SP
  • MiJing 3D BGA Reball Stencil For A9 iPhone 6S/6SP
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MiJing 3D BGA Reball Stencil For A9 iPhone 6S/6SP

Item NO.:3D BGA Reball Stencil A9  
Price:$13.00
Gross Weight:0.085kgs
Volume Weight:0.15kgs
Points:0.0
Views:399905
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MiJing 3D BGA Reball Stencil For A9 iPhone 6S/6SP




0.025mm thickness
3D BGA for A8 6 6P A9 6S 6SP A10 7 7P
It is 3D.
A8 contains all 6 6P BGA 
A9 contains all 6s 6sP
A10 contains all 7 7P

A11 contains all 8 8P X 

Feathure:

Stepped groove design enables stencil to align with tinning position of ic rapidly.
The square holes design makes it easier to take out the formed solder balls.
This 3D stencil is easy to use no matter you are a new or expert.
High success rate of planting tin,the solder balls can be formed once afer you are proficient.
This 3D planting stencil is thicker than ordinary stencils in the market.Less tendency of deformation makes its using life be longer.





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